The reaction during UV laser processing is realized by laser chemical ablation, that is, relying on laser energy to break the bond between atoms and molecules, so that they become small molecules and vaporize and evaporate.
1. Ultraviolet laser has short wavelength, good beam quality, and smaller focused spot.
2. Ultraviolet laser processing is cold processing and has little thermal influence.
3. Stable power pulse width output, especially suitable for ultra-fine micromachining field.
1. It is suitable for fine marking of superhard materials such as sapphire, quartz, ceramics and glass.
2. It is suitable for marking related accessories in the mobile phone and tablet industry, such as mobile phone covers, touch screens, data lines, power supplies, connectors, etc.
3. It is widely used for marking and perforating the surface of packaging bottles of food, medicine, cosmetics, wires and other polymer materials.
型号 | UV-3W/UV-5W |
平均输出功率 | 3W或5W |
激光波长 | 0.355µm |
激光频率 | 10-150khz |
标准雕刻范围 | 100*100mm/150*150mm |
雕刻线速 | <=7000mm/s |
最小线宽 | 0.01mm |
最小字符 | 0.2mm |
重复精度 | ±0.002mm |
电力需求 | 220V/60Hz |
整机耗电功率 | 500W |